发明名称 |
OPTICAL ELECTRONIC PACKAGE |
摘要 |
An electronic package includes a substrate wafer having front and rear faces. An emitting integrated circuit chip is mounted to the front face of the substrate wafer and includes a light radiation optical emitter. A receiving integrated circuit chip is also mounted to the front face of the substrate wafer and includes at least one light radiation optical sensor. A transparent encapsulant extends above the optical sensor and the optical emitter. An opaque encapsulant encapsulates the transparent encapsulant. The opaque encapsulant has a front window situated above the optical emitter and which is offset laterally relative to the optical sensor. The transparent encapsulant accordingly has an uncovered front face situated above the optical emitter and offset laterally relative to the optical sensor. The opaque encapsulant may include an additional front window. The receiving integrated circuit chip further includes a second optical sensor situated opposite the additional front window.
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申请公布号 |
US2013012276(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201213541066 |
申请日期 |
2012.07.03 |
申请人 |
STMICROELECTRONICS (GRENOBLE 2) SAS;COFFY ROMAIN;BRECHIGNAC REMI |
发明人 |
COFFY ROMAIN;BRECHIGNAC REMI |
分类号 |
H01L33/48;H04W88/02 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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