发明名称 STRUCTURE FOR FIXING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a structure for fixing an electronic component, which reduces strain of the electronic component due to expansion and contraction of a substrate so as to prevent damage of the electronic component. <P>SOLUTION: A structure 10 for fixing an electronic component comprises: a membrane member 12 which expands and contracts in the plane direction; a flexible sheet-like solar cell module 14 which is arranged on the surface of the membrane member 12; and a light transmissive sheet member 16 which covers the surface (light-receiving plane) of the solar cell module 14. The peripheral edge 16A of the sheet member 16 is bonded and fixed to the surface of the membrane member 12 at the periphery of the edge of the solar cell module 14 with an adhesive 18. When the membrane member 12 expands or contracts in the plane direction, the solar cell module 14 held inside the sheet member 16 moves relative to the membrane member 12, so that the generation of strain in the solar cell module 14 is suppressed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013002120(A) 申请公布日期 2013.01.07
申请号 JP20110133629 申请日期 2011.06.15
申请人 TAKENAKA KOMUTEN CO LTD;SAINT-GOBAIN KK;TELASYS CO LTD 发明人 YAMAMOTO SHUICHI;FUKAO KOZO;YUKAWA MASAHIRO;NAKAI MASAYOSHI;MIKI SHIGETO;OKAMOTO HAJIME;HASEGAWA KAN;TAKAHASHI HIROMU;OGAWA TOMOKAZU;YOSHIDA SHINGO;MURAKAMI NOBUNAO;MARCEL DERIE;KATHERINE M SAHLIN;KANBAYASHI MASAYOSHI;SUGIURA KOSUKE;YAO YUTAKA
分类号 E04D13/18;E04B1/32;E04H15/54;H01L31/042 主分类号 E04D13/18
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