发明名称 Silicon layer for stopping dislocation propagation
摘要 A composite semiconductor structure and method of forming the same are provided. The composite semiconductor structure includes a first silicon-containing compound layer comprising an element selected from the group consisting essentially of germanium and carbon; a silicon layer on the first silicon-containing compound layer, wherein the silicon layer comprises substantially pure silicon; and a second silicon-containing compound layer comprising the element on the silicon layer. The first and the second silicon-containing compound layers have substantially lower silicon concentrations than the silicon layer. The composite semiconductor structure may be formed as source/drain regions of metal-oxide-semiconductor (MOS) devices.
申请公布号 US8344447(B2) 申请公布日期 2013.01.01
申请号 US20070732889 申请日期 2007.04.05
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;LIN HSIEN-HSIN;CHANG WENG;SU CHIEN-CHANG;CHEN KUAN-YU;SUNG HSUEH-CHANG;YU MING-HUA 发明人 LIN HSIEN-HSIN;CHANG WENG;SU CHIEN-CHANG;CHEN KUAN-YU;SUNG HSUEH-CHANG;YU MING-HUA
分类号 H01L29/94 主分类号 H01L29/94
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