DEPOSITION APPARATUS

摘要

PURPOSE: A depositing apparatus is provided to uniformly form a thin film on a wafer by rotating the wafer and forming the thin film on the wafer. CONSTITUTION: Reactive gas is inputted to a susceptor. A wafer support unit(400) is arranged in the susceptor and includes a holder part(410) and a rotation driving unit. The holder part is arranged in the susceptor and supports the substrate. The rotation driving unit rotates the holder part and includes a shaft and a plurality of pins. The plurality of pins are extended from the shaft cross the rotation shaft of the shaft.