| 摘要 |
PURPOSE: A semiconductor device with an alignment mark and a manufacturing method thereof are provided to increase connection reliability by improving location adjusting precision. CONSTITUTION: A semiconductor device comprises a semiconductor device(11), a connection electrode, an alignment mark(16), and an underfill resin(18). The connection electrode is formed on the semiconductor device. The alignment mark is formed on the semiconductor device. One of alignment marks is made of a magnetic material. The underfill resin covers the connection electrode. |
