| 摘要 |
<p>The invention relates to heat dissipation means for use with electrical and/or electronic apparatus to provide for the improved cooling of at least one component within the housing of the apparatus. The heat dissipation means comprise a first portion located internally of the housing at or adjacent to the at least one component to be cooled and the means is formed of a material to allow the same to be passed via the first portion to an interface and onto a second portion located externally of the housing to allow the heat to be dissipated therefrom to the external environment more effectively. This allows heat to be dissipated without the need for moving heat dissipation means to be provided and avoids the noise and/or vibration which can be created.
</p> |
