发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve electric characteristics of a wiring board, especially, high speed transmission characteristics of a data signal. <P>SOLUTION: A wiring board comprises: a core substrate; a first wiring layer; and a second wiring layer. The first wiring layer includes wiring patterns 21, 22 and a first floating conductor pattern 23, and formed on a first surface of the core substrate. The second wiring layer includes signal terminals 24 for data signal transmission and power source terminals 25 for power sources, and formed on a second surface of the core substrate opposite to the first surface. The first floating conductor pattern 23 is arranged on the first surface of the core substrate in a region except parts opposite to the signal terminals 24. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012243800(A) 申请公布日期 2012.12.10
申请号 JP20110109439 申请日期 2011.05.16
申请人 ELPIDA MEMORY INC 发明人 SASAKI MASARU;ISA SATOSHI;KATAGIRI MITSUAKI
分类号 H05K1/02;H01L23/12 主分类号 H05K1/02
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