发明名称 METHOD FOR TREATING SUBSTRATE, DEVICE FOR TREATING SUBSTRATE AND STORAGE MEDIUM
摘要 <p>[Problem] To provide a method and the like for treating a substrate such that drying-preventing liquid entering a pattern on the substrate can be removed in a relatively short time. [Solution] A substrate (W), which is formed with an irregular pattern on a surface thereof, and to which drying-preventing liquid covering the pattern so as to enter the concave portions thereof adheres, is carried into a treatment container (31); the substrate (W) is then heated, and gas for pressurization or fluid in a high pressure state is supplied into the treatment container (31) to form a high pressure atmosphere in the treatment container (31) before the drying-preventing liquid vaporizes to such a degree that pattern collapse occurs, and place the drying-preventing liquid in a high pressure state while still in the concave portions of the pattern; and thereafter, the fluid in the treatment container (31) is discharged in a high pressure state or in a gaseous state.</p>
申请公布号 WO2012165377(A1) 申请公布日期 2012.12.06
申请号 WO2012JP63640 申请日期 2012.05.28
申请人 TOKYO ELECTRON LIMITED;MITSUOKA KAZUYUKI;YOU GEN;OHNO HIROKI;ORII TAKEHIKO;IWASHITA MITSUAKI;TOSHIMA TAKAYUKI 发明人 MITSUOKA KAZUYUKI;YOU GEN;OHNO HIROKI;ORII TAKEHIKO;IWASHITA MITSUAKI;TOSHIMA TAKAYUKI
分类号 H01L21/304 主分类号 H01L21/304
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