<p>Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip (15) that has a first conductor pad (85) and a passivation structure (45). A second conductor pad (120) is fabricated around but not in physical contact with the first conductor pad (85) to leave a gap (125). The second conductor pad (120) is adapted to protect a portion of the passivation structure (45).</p>
申请公布号
WO2012134710(A8)
申请公布日期
2012.12.06
申请号
WO2012US27631
申请日期
2012.03.03
申请人
ATI TECHNOLOGIES ULC;ADVANCED MICRO DEVICES, INC.;TOPACIO, RODEN, R.;SU, MICHAEL, Z.;MCLELLAN, NEIL