BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, AND METHOD OF PREPARING THE SAME

摘要

A bump with nanolaminated structure is provided. The bump with nanolaminated structure includes a bump, a nanolaminated structure and an organic layer. The nanolaminated structure is located on the bump. The organic layer is located between the bump and the nanolaminated structure. The organic molecular of the organic layer includes two terminal function groups, wherein a first terminal function group is bonded with a first metal atom of the bump and a second terminal function group is bonded with a second metal atom of the nanolaminated structure.