| 摘要 |
PURPOSE: A substrate plating apparatus with a bidirectional overflow function is provided to form an even plating layer on a substrate by allowing overflow of plating chemical through a circulating line formed in a plating bath and charging baths. CONSTITUTION: A substrate plating apparatus(10) comprises a plating bath(20), charging baths(30), a circulating line(40), and a heating device(50). The plating bath includes a partition(23) for forming a heating space on one side and an inlet at the bottom and is filled with liquid chemical for plating the surface of a substrate. The partition prevents chemical heated by the heating device from being directly transferred to a substrate. The charging baths are formed on both sides of the plating bath and filled with chemical flowing over the plating bath. The circulating line supplies chemical to the plating bath. The heating device is installed in the plating bath and heats chemical.
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