发明名称 |
SEMICONDUCTOR CHIP HAVING VIA ELECTRODES AND STACKED SEMICONDUCTOR CHIPS INTERCONNECTED BY THE VIA ELECTRODES |
摘要 |
A semiconductor device includes a semiconductor substrate and a via electrode. The via electrode has a first portion on the substrate and extends towards the substrate and has a plurality of spikes that extends from the first portion into the substrate, each of the spikes being spaced apart form one another.
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申请公布号 |
US2012299194(A1) |
申请公布日期 |
2012.11.29 |
申请号 |
US201213569653 |
申请日期 |
2012.08.08 |
申请人 |
LEE HO-JIN;CHUNG HYUN-SOO;JEON CHANG-SEONG;PARK SANG-SICK;PHEE JAE-HYUN |
发明人 |
LEE HO-JIN;CHUNG HYUN-SOO;JEON CHANG-SEONG;PARK SANG-SICK;PHEE JAE-HYUN |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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