| 摘要 |
PURPOSE: A hollow heat radiation device is provided to reduce manufacturing costs by preventing the degradation of the light efficiency of LEDs. CONSTITUTION: An LED package(10) is arranged on the lower side of a metal PCB(20). A hollow heat radiation plate(50) is installed on the upper side of the metal PCB. A heat radiation fin is installed on the metal PCB. An LED chip is mounted on the lower side of a heat radiation slug. An encapsulating material(6) is formed in the inside of a partition wall of the heat radiation slug. |
