发明名称 |
ELECTROLESS PLATING APPARATUS, METHOD OF ELECTROLESS PLATING, AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD |
摘要 |
An electroless plating solution is accommodated in a plating tank of an electroless plating apparatus. A reference electrode and a counter electrode are immersed in the electroless plating solution. A conductive member is provided to be electrically in contact with a conductive portion of a long-sized substrate. The conductive member, the reference electrode, and the counter electrode are connected to a potentiostat. A main control device controls the potential of the conductive portion of the long-sized substrate by a potentiostat such that the potential of the conductive portion of the long-sized substrate with respect to a potential of the reference electrode is equal to a potential of the independent portion of the long-sized substrate with respect to the potential of the reference electrode. |
申请公布号 |
US2012295013(A1) |
申请公布日期 |
2012.11.22 |
申请号 |
US201213461853 |
申请日期 |
2012.05.02 |
申请人 |
TSUNEKAWA MAKOTO;NITTO DENKO CORPORATION |
发明人 |
TSUNEKAWA MAKOTO |
分类号 |
B05D5/12;B05C3/09;H05K3/00 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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