LED HEAT DISSIPATION STRUCTURE AND BACKLIGHT MODULE

摘要

Disclosed are a heat dissipation structure (100) for LEDs and a backlight module (200). A plurality of heat-dissipating lamp holders (120) and at least one circuit board (140) are arranged on an upper surface of a heat dissipation substrate (110) of the heat dissipation structure (100) for LEDs. A recess (121) is provided on the top surface of each heat-dissipating lamp holder (120). At least one LED chip (130) is disposed in each recess (121). The LED chip (130) and the circuit board (140) are electrically connected through two conducting wires (150). The heat produced by the LED chip (130) is dissipated to outside through the heat-dissipating lamp holder (120) and heat dissipation substrate (110) without blocking of the circuit board (140). This improves the heat dissipation efficiency and service life of the heat dissipation structure (100) for LEDs.