| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide amorphous silica particle hardly being caught between bumps and capable of securing excellent conductivity when applied to bump connection as an underfill material by mixing with a curable resin. <P>SOLUTION: In the amorphous silica particle used in the underfill material, a load value (10% load value) when the diameter of the particle dislocate 10% in a compression test and an average diameter satisfy the following formula (I). 10% load value (mN)/average diameter (μm)>1.20 (I). <P>COPYRIGHT: (C)2013,JPO&INPIT |
