| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free solder alloy that is excellent in thermal fatigue resistance property even when being used in a high temperature environment. <P>SOLUTION: The lead-free solder alloy contains: 1.5-4.0 wt.% Ag; 1.0-2.5 wt.% Bi; 0.1-0.5 wt.% Zn; 0.05-0.1 wt.% Ni; and the balance Sn excluding inevitable impurities. The lead-free solder alloy is applicable, for example, to a solder joint part 106 where a substrate electrode 102 and an electronic part electrode 105 are electrically jointed, and improves its mechanical strength to improve the thermal fatigue resistance property under the high temperature environment of 125°C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
