WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which is capable of easily achieving an increase in capacitance of a capacitor built therein, a semiconductor device, and a method for manufacturing a wiring board.

SOLUTION: A wiring board 1 comprises: a board body 10 having a through-hole 10X penetrating between a first main surface R1 and a second main surface R2; a through-electrode 12 formed in the through-hole 10X; and a capacitor 20 having a capacitor part 21 formed by sequentially laminating a first electrode 22, a dielectric layer 23, and a second electrode 24 on an insulating film 11 covering the first main surface of the board body 10 and an inner wall surface of the through-hole 10X.

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