| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a high-frequency package which reduces leakage of a high-frequency signal from a vent hole. <P>SOLUTION: There is provided a high-frequency package comprising: a multilayer substrate 1 formed by stacking a plurality of dielectric substrates; a semiconductor device mounted on the multilayer substrate 1; a metal lid 3 bonded to the multilayer substrate 1 so as to surround a mount region of the semiconductor device in an approximately circular pattern, to form a cavity between the metal lid 3 and the multilayer substrate 1; solder 4 which bonds the multilayer substrate 1 and the metal lid 3; and a vent hole 5 formed between the multilayer substrate 1 and the metal lid 3 by the solder 4 which is broken and configured to let an inside and an outside of the cavity be communicated with each other via a detour. <P>COPYRIGHT: (C)2013,JPO&INPIT |
