发明名称 FABRICATION METHOD OF SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes a first semiconductor region of a first conductivity type; a second semiconductor region of a second conductivity type, disposed on a surface of the first semiconductor region, and having an impurity concentration higher than that of the first semiconductor region; a trench that penetrates the second semiconductor region to reach the first semiconductor region; a first electrode disposed inside the trench via an insulating film; a first recess portion disposed deeper than an upper end of the first electrode, in a surface layer of the second semiconductor region, so as to be in contact with the trench; and a second electrode embedded in the first recess portion.
申请公布号 US2012289012(A1) 申请公布日期 2012.11.15
申请号 US201213557674 申请日期 2012.07.25
申请人 MOMOTA SEIJI;FUJII TAKESHI;KAMIJIMA SATOSHI;ASAI MAKOTO;DENSO CORPORATION;FUJI ELECTRIC CO., LTD. 发明人 MOMOTA SEIJI;FUJII TAKESHI;KAMIJIMA SATOSHI;ASAI MAKOTO
分类号 H01L21/336 主分类号 H01L21/336
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