| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free solder alloy for glass bonding, which contains neither lead nor cadmium and can maintain working efficiency without changing conventional working conditions. <P>SOLUTION: The lead-free solder alloy contains 90.0-97.0 wt.% Sn, 2.0-6.0 wt.% Zn, 0.5-3.0 wt.% Ag, 0.01-0.5 wt.% Cu, 0.005-0.2 wt.% Ti, 0.002-0.02 wt.% Al, 0.002-0.02 wt.% Si, 0.001-0.01 wt.% Mn, and 0.001-0.01 wt.% B. <P>COPYRIGHT: (C)2013,JPO&INPIT |
