| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique allowing processing costs and environmental load to be reduced in a substrate processing apparatus and a substrate processing apparatus in which a resist film formed on a surface of a substrate is removed. <P>SOLUTION: A substrate W is heated by supplying hot water to a rear surface Wb of the substrate W. An oxidant holding head 3 holding a Caro's acid solid 309 is scan-moved with respect to a substrate surface Wf. A liquid layer 309a obtained by allowing the Caro's acid to melt is formed at an interface between the substrate surface Wf and the Caro's acid solid 309. A resist film attached to the substrate surface Wf is decomposed and removed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
