| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an evaluation method for a laser mark that can correctly and quantitatively discriminate the shape of a dot that would cause a reading failure in a reader, thereby improving the yield by preventing the reading failure of the laser mark and preventing failure that occurs due to reasons other than the quality of a wafer itself. <P>SOLUTION: A method for evaluating a laser mark formed on a wafer using a laser includes at least: a measurement step of measuring a dot shape of the laser mark; and a circularity calculation step of calculating the circularity of the measured dot shape of the laser mark. The laser mark is evaluated using the calculated circularity. <P>COPYRIGHT: (C)2013,JPO&INPIT |
