| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Co-Si-based copper alloy sheet which has excellent solder wettability and which undergoes formation of pinholes is reduced upon being soldered. <P>SOLUTION: The Co-Si-based copper alloy sheet contains 0.5 to 3.0 mass% of Co and 0.1 to 1.0 mass% of Si, with the remainder being Cu and unavoidable impurities, wherein a requirement represented by the following formula is fulfilled: [60 degrees specular glossiness G in the direction parallel to the rolling direction (RD)]-[60 degrees specular glossiness G in direction transverse to rolling direction (TD)]=90%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
