| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance surface flatness of a reflective mask. <P>SOLUTION: The exposure device comprises an electrostatic chuck 10 for reflective mask which holds a reflective mask 20 by the mask holding face and has a plurality of voids 11 internally, and a pressure control unit which controls the pressure in the voids 11 to change a surface shape of the mask holding face. In the manufacturing method of a semiconductor device using the exposure device, surface flatness of the reflective mask 20 is enhanced by adjusting the internal pressure of the voids 11 after the reflective mask 20 is held on the electrostatic chuck 10 for reflective mask, thereby changing the surface shape of the electrostatic chuck 10 for reflective mask. <P>COPYRIGHT: (C)2013,JPO&INPIT |
