| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC tag mounting structure before grinding in which a foreign substance is prevented from being deposited onto a surface of an adhesive agent layer for sealing an IC tag within a mounting hole of a mounting target. <P>SOLUTION: When forming an adhesive agent layer 12 for sealing an IC tag 11 within a mounting hole 2b by boring the mounting hole 2b beforehand on a mounting surface 2a of an inner ring 2 that is a mounting target and injecting an adhesive agent while disposing an IC tag 11 within the mounting hole 2b, a surface of the adhesive agent layer 12 is formed at a bottom side rather than an opening edge of the mounting hole 2b and before applying grinding to the mounting surface 2a, a cover 13 is inserted in the vicinity of an opening of the mounting hole 2b to cover the surface of the adhesive agent layer 12. Therefore, a foreign substance such as dust or grinding powder of the mounting surface 2a is prevented from being deposited onto the surface of the adhesive agent layer 12. <P>COPYRIGHT: (C)2013,JPO&INPIT |
