| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit deterioration in reliability. <P>SOLUTION: A semiconductor device 2 comprises a semiconductor element 40 having a surface electrode 44 formed on a surface and a conductive plate material 50 bonded on the surface electrode 44. The conductive plate material 50 includes a bottom face 102 facing the surface electrode 44, and a top face 104 opposite to the bottom face 102 and having a region to which a heavy current wire 60 is bonded. An area of the top face 104 is larger than an area of the bottom face 102. <P>COPYRIGHT: (C)2013,JPO&INPIT |
