| 摘要 |
An electromagnetic shielding cover is configured to shield different kinds of electronic assemblies on a PCB. The PCB includes at least one shielding frame. The at least one shielding frame surrounds the electronic assemblies. The electromagnetic shielding cover comprises a film and an electrically-conductive layer coated on the film. The film is made of insulated materials. The electrically-conductive layer has at least one electrically-conductive area corresponding to the at least one shielding frame, each electrically-conductive area defines a sealed shielding space in combination with a corresponding shielding frame, to shield the electronic assemblies.
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