摘要 |
A three roller multi-wire saw for cutting wafers includes two cutting rollers (11, 12) provided parallel to each other in a cutting chamber (71), and an auxiliary cutting roller (13) which is provided at or above the symmetry center of the two cutting rollers, such that the included angle a between cutting lines (31, 32) on the two sides of the auxiliary cutting roller and the plane (14) where the axes of the two cutting rollers are located is in the range of 0-30°; there are two sets of working stations (4, 5) and feeding systems thereof, which are configured symmetrically, with linear guide rails (43) thereof being perpendicular to the cutting lines on the two sides of the auxiliary cutting roller respectively. The cutting saw can cut two monocrystalline or twin-crystalline silicon rods simultaneously with stable cutting quality; and the device has small size, light weight, low power consumption, high production efficiency, great versatility and lower cutting production cost.
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申请人 |
HUANG, YUNING;LIU, YUNING;PAN, YONGTAO |
发明人 |
HUANG, YUNING;LIU, YUNING;PAN, YONGTAO |