| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance heat dissipation performance of a heat generating electronic component mounted on a circuit board. <P>SOLUTION: A heat generating electronic component 2a is mounted on the outer peripheral edge of a circuit board 3 in the close vicinity of the sidewall 10 (second wall part) of a case 5. A heat dissipation material 7 fills between a part of the bottom wall 9 (first wall part) of the case 5 in the close vicinity of the electronic component 2a and the electronic component 2a, and between a part of the sidewall 10 (second wall part) of the case 5 in the close vicinity of the electronic component 2a and the electronic component 2a. Since the heat generated from the electronic component 2a is conducted to the bottom wall 9 (first wall part) of the case 5 and the sidewall 10 (second wall part) of the case 5 through the heat dissipation material 7, heat dissipation performance of the heat generating electronic component 2a can be enhanced when compared with a case where the heat generated from the heat generating electronic component 2a is conducted only to the bottom wall 9 (first wall part) of the case 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
