发明名称 LED PACKAGE HAVING GLASS COVER AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: An LED package having a glass cover and a manufacturing method thereof are provided to create light having uniform color distribution by forming a resin layer including a fluorescent substance in the inner surface of the glass cover. CONSTITUTION: An LED chip(15) is arranged on the upper side of a substrate(13). A glass cover has an internal space covering up the LED chip. A photoelectric transformation layer(12) is formed on the surface forming the internal space. The photoelectric transformation layer is comprised of resin including a fluorescent substance. An electrode pattern is electrically connected to the LED chip. The electrode pattern is extended from the internal space to the exterior of the glass cover. A terminal part is formed on the bottom of the substrate.
申请公布号 KR20120114043(A) 申请公布日期 2012.10.16
申请号 KR20110031784 申请日期 2011.04.06
申请人 HANA MICRON INC. 发明人 JI, HYUN A;LEE, KYUNG WOO
分类号 H01L33/48;H01L33/50;H01L33/52 主分类号 H01L33/48
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