发明名称 |
LED PACKAGE HAVING GLASS COVER AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PURPOSE: An LED package having a glass cover and a manufacturing method thereof are provided to create light having uniform color distribution by forming a resin layer including a fluorescent substance in the inner surface of the glass cover. CONSTITUTION: An LED chip(15) is arranged on the upper side of a substrate(13). A glass cover has an internal space covering up the LED chip. A photoelectric transformation layer(12) is formed on the surface forming the internal space. The photoelectric transformation layer is comprised of resin including a fluorescent substance. An electrode pattern is electrically connected to the LED chip. The electrode pattern is extended from the internal space to the exterior of the glass cover. A terminal part is formed on the bottom of the substrate.
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申请公布号 |
KR20120114043(A) |
申请公布日期 |
2012.10.16 |
申请号 |
KR20110031784 |
申请日期 |
2011.04.06 |
申请人 |
HANA MICRON INC. |
发明人 |
JI, HYUN A;LEE, KYUNG WOO |
分类号 |
H01L33/48;H01L33/50;H01L33/52 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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