| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can improve reliability. <P>SOLUTION: A semiconductor device comprises: semiconductor elements 2, 3; heat spreaders 5, 15 bonded with the semiconductor elements 2, 3 via solder layers 9a-9d; a regulation part regulating dimensions between the semiconductor elements 2, 3 and the heat spreaders 5, 15; a housing part 10 provided on the outside of a region of the heat spreaders 5, 15 at which the semiconductor elements 2, 3 are bonded, and housing fused solder inside; and a holding part 11 circulating the fused solder held inside, between the housing part 10 and the holding part 11. During cooling of the fused solder, the holding part 11 refills the fused solder in the case where an amount of the fused solder housed in the housing part 10 is insufficient, and recovers the fused solder in the case where the amount of the fused solder is excess. <P>COPYRIGHT: (C)2013,JPO&INPIT |
