发明名称 CEILING ELECTRODE PLATE AND SUBSTRATE PROCESSING APPARATUS
摘要 <p>PURPOSE: A ceiling electrode plate and a substrate processing apparatus are provided to improve heat transfer efficiency between a cooling plate and the ceiling electrode plate by arranging a heat transfer sheet on a contact side of the ceiling electrode plate and the cooling plate. CONSTITUTION: A DC power supply is connected to a ceiling electrode plate(31) of a shower head. A heat transfer sheet(38) is arranged on a contact side of a cooling plate and a supporter. A plurality of gas holes(34) is formed on the ceiling electrode plate. Openings(41) corresponding to the gas holes is formed on the heat transfer sheet. A film thickness of the A heat transfer sheet is 30μm to 80μm.</p>
申请公布号 KR20120112218(A) 申请公布日期 2012.10.11
申请号 KR20120033070 申请日期 2012.03.30
申请人 TOKYO ELECTRON LIMITED 发明人 KOBAYASHI YOSHIYUKI
分类号 H01L21/3065 主分类号 H01L21/3065
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