发明名称 |
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
<p>[Problem] To provide a negative photosensitive resin composition, which can be formed into a thick film even a solution thereof has a low viscosity, which is free from tack even before exposure, which can be patterned with high resolution by alkaline development, and a coating film formed from which has high transparency and is reduced in shrinkage after post baking. [Solution] A photosensitive resin composition which contains the following component (A), component (B), component (C) and component (D). Component (A): an acrylic copolymer which is obtained by copolymerizing a monomer mixture that contains at least (i) maleimide and (ii) a monomer having an epoxy group Component (B): a photoacid generator Component (C): a compound having two or more epoxy groups Component (D): a solvent</p> |
申请公布号 |
WO2012133429(A1) |
申请公布日期 |
2012.10.04 |
申请号 |
WO2012JP57965 |
申请日期 |
2012.03.27 |
申请人 |
NISSAN CHEMICAL INDUSTRIES, LTD.;HATANAKA, TADASHI;HATTORI, HAYATO;UCHIYAMA, MEGUMI |
发明人 |
HATANAKA, TADASHI;HATTORI, HAYATO;UCHIYAMA, MEGUMI |
分类号 |
G03F7/038;C08F220/32;C08F222/40;G03F7/004 |
主分类号 |
G03F7/038 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|