发明名称 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>[Problem] To provide a negative photosensitive resin composition, which can be formed into a thick film even a solution thereof has a low viscosity, which is free from tack even before exposure, which can be patterned with high resolution by alkaline development, and a coating film formed from which has high transparency and is reduced in shrinkage after post baking. [Solution] A photosensitive resin composition which contains the following component (A), component (B), component (C) and component (D). Component (A): an acrylic copolymer which is obtained by copolymerizing a monomer mixture that contains at least (i) maleimide and (ii) a monomer having an epoxy group Component (B): a photoacid generator Component (C): a compound having two or more epoxy groups Component (D): a solvent</p>
申请公布号 WO2012133429(A1) 申请公布日期 2012.10.04
申请号 WO2012JP57965 申请日期 2012.03.27
申请人 NISSAN CHEMICAL INDUSTRIES, LTD.;HATANAKA, TADASHI;HATTORI, HAYATO;UCHIYAMA, MEGUMI 发明人 HATANAKA, TADASHI;HATTORI, HAYATO;UCHIYAMA, MEGUMI
分类号 G03F7/038;C08F220/32;C08F222/40;G03F7/004 主分类号 G03F7/038
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