| 发明名称 |
System and Process For Heating Semiconductor Wafers by Optimizing Absorption of Electromagnetic Energy |
| 摘要 |
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
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| 申请公布号 |
US2012252229(A1) |
申请公布日期 |
2012.10.04 |
| 申请号 |
US201213524931 |
申请日期 |
2012.06.15 |
| 申请人 |
TIMANS PAUL JANIS;MATTSON TECHNOLOGY, INC. |
发明人 |
TIMANS PAUL JANIS |
| 分类号 |
F27B17/00;H01L21/268;C23C16/48;C30B25/10;C30B31/12;F27D99/00;H01L21/00;H01L21/26;H01L21/263 |
主分类号 |
F27B17/00 |
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