ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER ETC.

摘要

The issue of the present invention is to provide an adhesive tape for processing semiconductor wafers and the like, with which a quantity of an adhesive left on the surface of a material that has had a tape adhered thereon can be sufficiently reduced after the tape is peeled. An adhesive tape (100) for processing semiconductor wafers and the like is provided with a base material layer (200), and an adhesive layer (300). The adhesive layer (300) is formed at least on one surface of the base material layer (200). Furthermore, the adhesive layer (300) is mainly composed of a carboxyl group-containing polymer. The carboxyl group-containing polymer contains a radiation polymerizable compound (specifically, urethaneacrylate).