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发明名称
METHOD FOR FORMING SOLID BLIND VIAS THROUGH THE DIELECTRIC COATING ON HIGH DENSITY INTERCONNECT (HDI) SUBSTRATE MATERIALS
摘要
申请公布号
HK1141195(A1)
申请公布日期
2012.09.28
申请号
HK20100107375
申请日期
2010.08.03
申请人
PPG INDUSTRIES OHIO INC.
发明人
OLSON, KEVIN C.;WANG, ALAN E.
分类号
H05K
主分类号
H05K
代理机构
代理人
主权项
地址
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