METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to facilitate planarization and prevent plating deviation by not performing a plating process when a hole is formed. CONSTITUTION: A film layer is laminated on a metal layer(S100). A part of the film layer is removed by corresponding to a via hole forming area(S110). The exposed part of the metal layer is filled with conductive paste(S120). The remaining film layer is removed(S130). An insulation layer and a metal layer are successively laminated on the metal layer filled with the conductive paste(S140). A circuit pattern is formed in the metal layer(S150). A solder resist is coated on the circuit pattern(S160). [Reference numerals] (AA) Start; (BB) Finish; (S100) Laminating a film layer on a metal layer; (S110) Removing a part of a film layer by corresponding to a via hole forming area; (S120) Filling the exposed part of a metal layer with conductive paste; (S130) Separating and removing the remaining part of the film layer; (S140) Successively laminating an insulation layer and metal layer on the metal layer filled with conductive filler; (S150) Forming a circuit pattern; (S160) Coating solder resist and forming a solder pattern