THIN FILM THROUGH-GLASS VIA AND METHODS FOR FORMING SAME

摘要

This disclosure provides systems, methods and apparatus providing electrical connections through glass substrates. In one aspect, a thin film through-glass via including a through-glass via hole and a thin conductive film that conformally coats the sidewalls of the through-glass via hole is provided. A contour of a through-glass via hole may include concave portions that overlap at a midsection of the glass, with the through-glass via hole sidewalls curved inward to form the concave portions. In another aspect, one or more methods of forming through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a contoured through-glass via hole, followed by deposition of a thin continuous film of a conductive material.