| 摘要 |
<p>An MEMS microphone and integrated pressure sensor, comprising: a first substrate having a sensing diaphragm of a capacitive pressure sensor unit, a sensitive diaphragm of a microphone unit, and a first bonding layer on a surface of the first substrate, a second substrate having an inter-conductor dielectric layer, a conductor connection layer arranged within the inter-conductor dielectric layer, and/or a second bonding layer on a surface of the second substrate. The second substrate and the first substrate are oppositely arranged, and are fixedly connected via the first bonding layer and the second bonding layer; the first bonding layer and the second bonding layer have matching patterns and are both made from a conductive material. Correspondingly, in the MEMS microphone and integrated pressure sensor and a manufacturing method therefor, the capacitive pressure sensor unit and the microphone unit are integrated using the two substrates, applicable in mass-produced chip structure integrating various MEMS sensors. This facilitates compatibility with integrated circuit manufacturing technique, improved standardization of manufacturing technique and of packaging technique, and allows for a compact component, a great performance on signal-to-noise ratio, and a great anti-interference capability.</p> |
