ADHESIVE-BONDED STRUCTURE COMPRISING BOTH ADHESIVE COMPOSITION AND WOOD MATERIAL

摘要

The present invention addresses the problem of providing, using a curable composition which comprises a polymer having reactive silicon groups, an adhesive-bonded wood structure which combines high strength and boiling water resistance. Incidentally, a polymer having reactive silicon groups is a less toxic and environment-conscious polymeric material. A high-strength and -modulus curable composition can be obtained using an organic polymer having reactive silicon groups which comprises both a (meth)acrylic ester polymer having a specific structure and a polyoxyalkylene polymer. Further, an adhesive-bonded wood structure which exhibits excellent strength and excellent boiling water resistance can be obtained using the curable composition as the adhesive. Thus, the above problem can be resolved.