| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip chip mounting method capable of efficiently mounting a semiconductor chip on a circuit board. <P>SOLUTION: The flip chip mounting method includes a chip preparation step in which a semiconductor chip 10 which contains a salient electrode 2 on a circuit surface S, with an insulating resin layer 3 formed on the circuit surface S, is placed on a support fitting 6 with the circuit surface S looking downward, a chip pick up step in which a sucking tool 7 which contains a sucking surface provided with an air-sucking hole on a lower surface is caused to approach the semiconductor chip 10 placed on the support fitting 6 from above, and at the position where the sucking surface does not contact to the semiconductor chip 10, the semiconductor chip 10 is picked up from the support fitting 6 by air-sucking through the air-sucking hole, to be sucked to the sucking surface in non-contact manner, and a chip mounting step in which the circuit surface S of the semiconductor chip 10 is caused to pressurize the circuit board 4 by the sucking tool 7 while the semiconductor chip 10 is heated, so that the circuit board 4 and the semiconductor chip 10 are electrically connected to each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
