发明名称 Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature
摘要 Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
申请公布号 US2012222960(A1) 申请公布日期 2012.09.06
申请号 US201213409950 申请日期 2012.03.01
申请人 KUMAR ANANDA H.;ALBARRAN JORGE SOTELO;COHEN ADAM L.;KIM KIEUN;LOCKARD MICHAEL S.;FRODIS URI;SMALLEY DENNIS R.;MICROFABRICA INC. 发明人 KUMAR ANANDA H.;ALBARRAN JORGE SOTELO;COHEN ADAM L.;KIM KIEUN;LOCKARD MICHAEL S.;FRODIS URI;SMALLEY DENNIS R.
分类号 C25D5/02 主分类号 C25D5/02
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