| 摘要 |
The present invention provides a ceramic electronic component and a method for designing a ceramic electronic component in which cracks do not occur in the portion where an external electrode and solder are joined, or in which cracks that have occurred slowly increase in size even when a heating/cooling temperature cycling test is carried out. The present invention is a ceramic electronic component (10) comprising: a ceramic sintered compact (1); and an external electrode (2) formed on the outside of the ceramic sintered compact (1) and that includes an electroconductive resin (20). The external electrode (2) is composed of a base electrode (3), an electroconductive resin (20), and a plating (6), and the coefficient of linear expansion at the surface of the external electrode (2) joined to the mount board (other board) using solder matches the coefficient of linear expansion at the surface of the solder.
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