| 发明名称 |
Multi-chip semiconductor connector |
| 摘要 |
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is suitable for attaching to a first semiconductor die and a second conductive strip that is attached suitable for attaching to a second semiconductor die. |
| 申请公布号 |
US8253239(B2) |
申请公布日期 |
2012.08.28 |
| 申请号 |
US20100956786 |
申请日期 |
2010.11.30 |
| 申请人 |
CARNEY FRANCIS J.;CELAYA PHILLIP;FAUTY JOSEPH K.;LETTERMAN JAMES P.;ST. GERMAIN STEPHEN;YODER JAY A.;SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
CARNEY FRANCIS J.;CELAYA PHILLIP;FAUTY JOSEPH K.;LETTERMAN JAMES P.;ST. GERMAIN STEPHEN;YODER JAY A. |
| 分类号 |
H01L23/04;H01L21/60;H01L23/48;H01L23/495 |
主分类号 |
H01L23/04 |
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