CMP PAD CONDITIONER AND METHOD FOR MANUFACTURING

摘要

PURPOSE: A CMP pad conditioner and a manufacturing method thereof are provided to reduce manufacturing time and manufacturing costs since excellent abrasion resistance and surface roughness on a diamond coating layer are obtained without a diamond particle grain removal process. CONSTITUTION: A plurality of cut tips(11) is formed on one side of a substrate(10). A plurality of cut-tip patterns is formed on a partitioned region on the substrate. A diamond coating layer(20) comprises a first diamond thin film layer(21) and a second diamond thin film layer(23). The first diamond thin film layer is coated on the cut tips of the substrate. The second diamond thin film layer is formed on the first diamond thin film layer.