发明名称 |
FAN-OUT CHIP SCALE PACKAGE |
摘要 |
A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads. |
申请公布号 |
WO2011080672(A3) |
申请公布日期 |
2012.08.23 |
申请号 |
WO2010IB56012 |
申请日期 |
2010.12.22 |
申请人 |
NXP B.V.;HOCHSTENBACH, HENDRIK PIETER;VON GEMERT, LEONARDUS ANTONIUS ELISABETH |
发明人 |
HOCHSTENBACH, HENDRIK PIETER;VON GEMERT, LEONARDUS ANTONIUS ELISABETH |
分类号 |
H01L21/683;H01L21/56;H01L21/60;H01L23/31;H01L23/48 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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