| 摘要 |
<P>PROBLEM TO BE SOLVED: To supply a stable reference potential to a plurality of package substrates. <P>SOLUTION: A plurality of first package substrates 11a and 11b have mounting regions of semiconductor elements 2a and 2b, respectively, and are stacked to each other via solder balls 3 for stacking. A second package substrate 12 has multi-step recess 121 having a size corresponding to the plurality of first package substrates 11a and 11b, covers the plurality of first package substrates 11a and 11b so that the plurality of first package substrates 11a and 11b are housed in the multi-step recess 121, and includes reference potential wiring 122 that is electrically connected to each of the plurality of first package substrates 11a and 11b via solder balls 4 for connection. The plurality of first package substrates 11a and 11b are each electrically connected to the reference potential wiring 122 at the step portions corresponding to the multi-step recess 121 or at the bottom of the multi-step recess 121. <P>COPYRIGHT: (C)2012,JPO&INPIT |
