发明名称 MOLD-FORMING SUBSTRATE AND INSPECTION METHOD
摘要 <p>PURPOSE: A mold substrate and a method for inspecting the same are provided to prevent a mismatch of a pattern location in a pattern transfer process. CONSTITUTION: A circular mold substrate(1) is prepared. An uneven pattern is formed on the surface of a substrate. The thickness variation of the substrate is 10 um or less. The substrate comprises an upper surface(2), a lower surface(3), and a lateral surface(4). A chamfer(5) is respectively formed in a boundary of the lower surface, the upper surface, and the lateral surface of the substrate.</p>
申请公布号 KR20120092025(A) 申请公布日期 2012.08.20
申请号 KR20120012090 申请日期 2012.02.07
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 HARADA DAIJITSU;TAKEUCHI MASAKI
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址