| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus that can excellently remove rinsing liquid from a surface of a substrate. <P>SOLUTION: Pure water is supplied onto a surface of a wafer W, and rinsing processing to the surface of the wafer W (processing for washing the surface of the wafer W with the pure water) is performed. Then, IPA liquid having surface tension lower than the pure water is supplied onto the surface of the wafer W. Besides, in parallel with supply of the IPA liquid, warm water is supplied onto a backside which is opposite to the surface of the wafer W. <P>COPYRIGHT: (C)2012,JPO&INPIT |
